日本半導体市場規模シェア、競争環境、トレンド分析レポート:デバイス別(ディスクリート半導体、オプトエレクトロニクス、センサー、集積回路、その他)、コンポーネント別(メモリデバイス、ロジックデバイス、アナログIC、メモリ保護ユニット、ディスクリートパワーデバイス、多点制御ユニット、センサー、その他)、タイプ別(真性材料、真性外材料)、ノードサイズ別(5nm、5/7nm、7/10nm、14/16nm、20/22nm、 28/32nm、 40/45nm、 65nm、 90nm、 130nm、 180nm)、 材料タイプ別 ( ケイ素、 ゲルマニウム、 ガリウムヒ素、 炭化ケイ素、 窒化ガリウム、 その他)、 用途別 ( ネットワーキングおよび通信、 データ処理、 家電製品、 発電、 電子部品、 その他)、 エンドユーザー別 ( 電気通信、 エネルギー、 電気および電子、 医療およびヘルスケア、 自動車、 航空宇宙、 防衛および軍事、 政府、 その他):2024年から2034年までの機会分析および業界予測

レポートID : ROJP1024303  |  発行日 : 2024年10月  |  フォーマット :  :   : 

1 Preface

2 Scope and Methodology

2.1 Objectives of the Study

2.2 Stakeholders

2.3 Data Sources

2.3.1 Primary Sources

2.3.2 Secondary Sources

2.4 Market Estimation

2.4.1 Bottom-Up Approach

2.4.2 Top-Down Approach

2.5 Forecasting Methodology

3 Executive Summary

4 Japan Semiconductor Market - Introduction

4.1 Overview

4.2 Market Dynamics

4.3 Industry Trends

4.4 Competitive Intelligence

5 Japan Semiconductor Market Landscape

5.1 Historical and Current Market Trends (2019-2022)

5.2 Market Forecast (2023-2032)

6 Japan Semiconductor Market - Breakup by Devices

6.1 Discrete Semiconductors

6.1.1 Overview

6.1.2 Historical and Current Market Trends (2019-2022)

6.1.3 Market Forecast (2023-2032)

6.2 Optoelectronics

6.2.1 Overview

6.2.2 Historical and Current Market Trends (2019-2022)

6.2.3 Market Forecast (2023-2032)

6.3 Optoelectronics

6.3.1 Overview

6.3.2 Historical and Current Market Trends (2019-2022)

6.3.3 Market Forecast (2023-2032)

6.4 Integrated Circuits

6.4.1 Overview

6.4.2 Historical and Current Market Trends (2019-2022)

6.4.3 Market Forecast (2023-2032)

6.5 Others

6.4.1 Overview

6.4.2 Historical and Current Market Trends (2019-2022)

6.4.3 Market Forecast (2023-2032)

7 Japan Semiconductor Market - Breakup by Components

7.1 Memory Devices

7.1.1 Overview

7.1.2 Historical and Current Market Trends (2019-2022)

7.1.3 Market Forecast (2023-2032)

7.2 Logic Devices

7.2.1 Overview

7.2.2 Historical and Current Market Trends (2019-2022)

7.2.3 Market Forecast (2023-2032)

7.3 Analog IC

7.3.1 Overview

7.3.2 Historical and Current Market Trends (2019-2022)

7.3.3 Market Forecast (2023-2032)

7.4 Memory protection unit

7.4.1 Overview

7.4.2 Historical and Current Market Trends (2019-2022)

7.4.3 Market Forecast (2023-2032)

7.5 Discrete Power Devices

7.5.1 Overview

7.5.2 Historical and Current Market Trends (2019-2022)

7.5.3 Market Forecast (2023-2032)

7.6 Multipoint control unit

7.6.1 Overview

7.6.2 Historical and Current Market Trends (2019-2022)

7.6.3 Market Forecast (2023-2032)

7.7 Sensors

7.7.1 Overview

7.7.2 Historical and Current Market Trends (2019-2022)

7.7.3 Market Forecast (2023-2032)

7.8 Others

7.8.1 Overview

7.8.2 Historical and Current Market Trends (2019-2022)

7.8.3 Market Forecast (2023-2032)

8 Japan Semiconductor Market - Breakup by Type

8.1 Intrinsic material

8.1.1 Overview

8.1.2 Historical and Current Market Trends (2019-2022)

8.1.3 Market Forecast (2023-2032)

8.2 Extrinsic material

8.2.1 Overview

8.2.2 Historical and Current Market Trends (2019-2022)

8.2.3 Market Forecast (2023-2032)

9 Japan Semiconductor Market - Breakup by Node Size

9.1 5nm

9.1.1 Overview

9.1.2 Historical and Current Market Trends (2019-2022)

9.1.3 Market Forecast (2023-2032)

9.2 5/7nm

9.2.1 Overview

9.2.2 Historical and Current Market Trends (2019-2022)

9.2.3 Market Forecast (2023-2032)

9.3 7/10nm

9.3.1 Overview

9.3.2 Historical and Current Market Trends (2019-2022)

9.3.3 Market Forecast (2023-2032)

9.4 13/15nm

9.4.1 Overview

9.4.2 Historical and Current Market Trends (2019-2022)

9.4.3 Market Forecast (2023-2032)

9.5 20/22nm

9.5.1 Overview

9.5.2 Historical and Current Market Trends (2019-2022)

9.5.3 Market Forecast (2023-2032)

9.6 28/32nm

9.6.1 Overview

9.6.2 Historical and Current Market Trends (2019-2022)

9.6.3 Market Forecast (2023-2032)

9.7 40/45nm

9.7.1 Overview

9.7.2 Historical and Current Market Trends (2019-2022)

9.7.3 Market Forecast (2023-2032)

9.8 65nm

9.8.1 Overview

9.8.2 Historical and Current Market Trends (2019-2022)

9.8.3 Market Forecast (2023-2032)

9.9 90nm

9.1.1 Overview

9.1.2 Historical and Current Market Trends (2019-2022)

9.1.3 Market Forecast (2023-2032)

9.10 130nm

9.2.1 Overview

9.2.2 Historical and Current Market Trends (2019-2022)

9.2.3 Market Forecast (2023-2032)

9.11 180nm

9.3.1 Overview

9.3.2 Historical and Current Market Trends (2019-2022)

9.3.3 Market Forecast (2023-2032)

10 Japan Semiconductor Market - Breakup by Material Type

10.1 Silicon

10.1.1 Overview

10.1.2 Historical and Current Market Trends (2019-2022)

10.1.3 Market Forecast (2023-2032)

10.2 Germanium

10.2.1 Overview

10.2.2 Historical and Current Market Trends (2019-2022)

10.2.3 Market Forecast (2023-2032)

10.3 Gallium arsenide

10.3.1 Overview

10.3.2 Historical and Current Market Trends (2019-2022)

10.3.3 Market Forecast (2023-2032)

10.4 Silicon carbide

10.4.1 Overview

10.4.2 Historical and Current Market Trends (2019-2022)

10.4.3 Market Forecast (2023-2032)

10.5 Gallium Nitride

10.5.1 Overview

10.5.2 Historical and Current Market Trends (2019-2022)

10.5.3 Market Forecast (2023-2032)

11 Japan Semiconductor Market - Breakup by Application

11.1 Networking and Communication

11.1.1 Overview

11.1.2 Historical and Current Market Trends (2019-2022)

11.1.3 Market Forecast (2023-2032)

11.2 Data Processing

11.2.1 Overview

11.2.2 Historical and Current Market Trends (2019-2022)

11.2.3 Market Forecast (2023-2032)

11.3 Consumer Electronics

11.3.1 Overview

11.3.2 Historical and Current Market Trends (2019-2022)

11.3.3 Market Forecast (2023-2032)

11.4 Power Generation

11.4.1 Overview

11.4.2 Historical and Current Market Trends (2019-2022)

11.4.3 Market Forecast (2023-2032)

11.5 Electronic Components

11.5.1 Overview

11.5.2 Historical and Current Market Trends (2019-2022)

11.5.3 Market Forecast (2023-2032)

11.6 Others

11.6.1 Overview

11.6.2 Historical and Current Market Trends (2019-2022)

11.6.3 Market Forecast (2023-2032)

12 Japan Semiconductor Market - Breakup by End-User

12.1 Telecommunication

12.1.1 Overview

12.1.2 Historical and Current Market Trends (2019-2022)

12.1.3 Market Forecast (2023-2032)

12.2 Energy

12.2.1 Overview

12.2.2 Historical and Current Market Trends (2019-2022)

12.2.3 Market Forecast (2023-2032)

12.3 Electrical and Electronics

12.3.1 Overview

12.3.2 Historical and Current Market Trends (2019-2022)

12.3.3 Market Forecast (2023-2032)

12.4 Medical and Healthcare

12.4.1 Overview

12.4.2 Historical and Current Market Trends (2019-2022)

12.4.3 Market Forecast (2023-2032)

12.5 Automotive

12.5.1 Overview

12.5.2 Historical and Current Market Trends (2019-2022)

12.5.3 Market Forecast (2023-2032)

12.6 Aerospace

12.6.1 Overview

12.6.2 Historical and Current Market Trends (2019-2022)

12.6.3 Market Forecast (2023-2032)

12.7 Defense and Military

12.7.1 Overview

12.7.2 Historical and Current Market Trends (2019-2022)

12.7.3 Market Forecast (2023-2032)

12.8 Government

12.8.1 Overview

12.8.2 Historical and Current Market Trends (2019-2022)

12.8.3 Market Forecast (2023-2032)

13 Japan Semiconductor Market – Breakup by Region

13.1 Kanto Region

13.1.1 Overview

13.1.2 Historical and Current Market Trends (2019-2022)

13.1.3 Market Breakup by Components

13.1.4 Market Breakup by Material Used

13.1.5 Market Breakup by End User

13.1.6 Key Players

13.1.7 Market Forecast (2023-2032)

13.2 Kinki Region

13.2.1 Overview

13.2.2 Historical and Current Market Trends (2019-2022)

13.2.3 Market Breakup by Components

13.2.4 Market Breakup by Material Used

13.2.5 Market Breakup by End User

13.2.6 Key Players

13.2.7 Market Forecast (2023-2032)

13.3 Central/ Chubu Region

13.3.1 Overview

13.3.2 Historical and Current Market Trends (2019-2022)

13.3.3 Market Breakup by Components

13.3.4 Market Breakup by Material Used

13.3.5 Market Breakup by End User

13.3.6 Key Players

13.3.7 Market Forecast (2023-2032)

13.4 Kyushu-Okinawa Region

13.4.1 Overview

13.4.2 Historical and Current Market Trends (2019-2022)

13.4.3 Market Breakup by Components

13.4.4 Market Breakup by Material Used

13.4.5 Market Breakup by End User

13.4.6 Key Players

13.4.7 Market Forecast (2023-2032)

13.5 Tohoku Region

13.5.1 Overview

13.5.2 Historical and Current Market Trends (2019-2022)

13.5.3 Market Breakup by Components

13.5.4 Market Breakup by Material Used

13.5.5 Market Breakup by End User

13.5.6 Key Players

13.5.7 Market Forecast (2023-2032)

13.6 Chugoku Region

13.6.1 Overview

13.6.2 Historical and Current Market Trends (2019-2022)

13.6.3 Market Breakup by Components

13.6.4 Market Breakup by Material Used

13.6.5 Market Breakup by End User

13.6.6 Key Players

13.6.7 Market Forecast (2023-2032)

13.7 Hokkaido Region

13.7.1 Overview

13.7.2 Historical and Current Market Trends (2019-2022)

13.7.3 Market Breakup by Components

13.7.4 Market Breakup by Material Used

13.7.5 Market Breakup by End User

13.7.6 Key Players

13.7.7 Market Forecast (2023-2032)

13.8 Shikoku Region

13.8.1 Overview

13.8.2 Historical and Current Market Trends (2019-2022)

13.8.3 Market Breakup by Components

13.8.4 Market Breakup by Material Used

13.8.5 Market Breakup by End User

13.8.6 Key Players

13.8.7 Market Forecast (2023-2032)

14 Japan Semiconductor Market – Competitive Landscape

14.1 Overview

14.2 Market Structure

14.3 Market Player Positioning

14.4 Top Winning Strategies

14.5 Competitive Dashboard

14.6 Company Evaluation Quadrant

15 Profiles of Key Players

15.1 TDK Corporation

15.1.1 Business Overview

15.1.2 Services Offered

15.1.3 Business Strategies

15.1.4 SWOT Analysis

11.1.5 Major News and Events

15.2 IPFlex

15.2.1 Business Overview

15.2.2 Services Offered

15.2.3 Business Strategies

15.2.4 SWOT Analysis

15.2.5 Major News and Events

15.3 PEZY Computing

15.3.1 Business Overview

15.3.2 Services Offered

15.3.3 Business Strategies

15.3.4 SWOT Analysis

15.3.5 Major News and Events

15.4 Kodenshi AUK Group

15.4.1 Business Overview

15.4.2 Services Offered

15.4.3 Business Strategies

15.4.4 SWOT Analysis

15.4.5 Major News and Events

15.5 THine Electronics

15.5.1 Business Overview

15.5.2 Services Offered

15.5.3 Business Strategies

15.5.4 SWOT Analysis

15.5.5 Major News and Events

15.6 Socionext

15.6.1 Business Overview

15.6.2 Services Offered

15.6.3 Business Strategies

15.6.4 SWOT Analysis

15.6.5 Major News and Events

15.7 Mitsubishi Electric

15.7.1 Business Overview

15.7.2 Services Offered

15.7.3 Business Strategies

15.7.4 SWOT Analysis

15.7.5 Major News and Events

15.8 Toshiba Corporation

15.8.1 Business Overview

15.8.2 Services Offered

15.8.3 Business Strategies

15.8.4 SWOT Analysis

15.8.5 Major News and Events

15.9 Renesas Electronics

15.9.1 Business Overview

15.9.2 Services Offered

15.9.3 Business Strategies

15.9.4 SWOT Analysis

15.9.5 Major News and Events

15.10 Micron Memory Japan

15.10.1 Business Overview

15.10.2 Services Offered

15.10..3 Business Strategies

15.10.4 SWOT Analysis

15.10.5 Major News and Events

15.11 JAPAN MATERIAL Co

15.11.1 Business Overview

15.11.2 Services Offered

15.11.3 Business Strategies

15.11.4 SWOT Analysis

15.11.5 Major News and Events

15.12 Sanyo Electric Co., Ltd.

15.12.1 Business Overview

15.12.2 Services Offered

15.12.3 Business Strategies

15.12.4 SWOT Analysis

15.12.5 Major News and Events

15.13 Rapidus Corporation

15.13.1 Business Overview

15.13.2 Services Offered

15.13.3 Business Strategies

15.13.4 SWOT Analysis

15.13.5 Major News and Events

15.13 Seiko Group Corporation

15.13.1 Business Overview

15.13.2 Services Offered

15.13.3 Business Strategies

15.13.4 SWOT Analysis

15.13.5 Major News and Events

15.14 Sharp Corporation

15.14.1 Business Overview

15.14.2 Services Offered

15.14.3 Business Strategies

15.14.4 SWOT Analysis

15.14.5 Major News and Events

15.15 Shin-Etsu Chemical

15.15.1 Business Overview

15.15.2 Services Offered

15.15.3 Business Strategies

15.15.4 SWOT Analysis

15.15.5 Major News and Events

15.16 FERROTEC HOLDINGS Corp

15.16.1 Business Overview

15.16.2 Services Offered

15.16.3 Business Strategies

15.16.4 SWOT Analysis

15.16.5 Major News and Events

15.17 SUMCO Corporation

15.17.1 Business Overview

15.17.2 Services Offered

15.17.3 Business Strategies

15.17.4 SWOT Analysis

15.17.5 Major News and Events

15.18 Dainippon Screen

15.18.1 Business Overview

15.18.2 Services Offered

15.18.3 Business Strategies

15.18.4 SWOT Analysis

15.18.5 Major News and Events

15.19 AOI ELECTRONICS

15.19.1 Business Overview

15.19.2 Services Offered

15.19.3 Business Strategies

15.19.4 SWOT Analysis

15.19.5 Major News and Events

15.20 Intel Corporation

15.20.1 Business Overview

15.20.2 Services Offered

15.20.3 Business Strategies

15.20.4 SWOT Analysis

15.20.5 Major News and Events

15.21 Shindengen Electric Manufacturing

15.21.1 Business Overview

15.21.2 Services Offered

15.21.3 Business Strategies

15.21.4 SWOT Analysis

15.21.5 Major News and Events

15.22 FURUYA METAL C

15.22.1 Business Overview

15.22.2 Services Offered

15.22.3 Business Strategies

15.22.4 SWOT Analysis

15.22.5 Major News and Events

15.23 Samsung Electronics

15.23.1 Business Overview

15.23.2 Services Offered

15.23.3 Business Strategies

15.23.4 SWOT Analysis

15.23.5 Major News and Events

15.24 Others

15.24.1 Business Overview

15.24.2 Services Offered

15.24.3 Business Strategies

15.24.4 SWOT Analysis

15.24.5 Major News and Events

16 Japan Semiconductor Market - Industry Analysis

16.1 Drivers, Restraints, and Opportunities

16.1.1 Overview

16.1.2 Drivers
16.1.2.1 Support by the Government for Local Chip Manufacturing
16.1.3 Restraints
16.1.3.1 Inventory Drawdowns with Technological Advances and Higher Capital Costs
16.1.4 Opportunities
16.1.4.1 A Surge in the Utilization of Memory Devices
16.2 Porters Five Forces Analysis

16.2.1 Overview

16.2.2 Bargaining Power of Buyers

16.2.3 Bargaining Power of Suppliers

16.2.4 Degree of Competition

16.2.5 Threat of New Entrants

16.2.6 Threat of Substitutes

16.3 Value Chain Analysis

17 Appendix

Booklet
  • 発行日 :
    Oct-2024
  • 予想年 :
    2024年~2032年
  • 納期 :
    即日から翌営業日

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