日本半導体市場規模シェア、競争環境、トレンド分析レポート:デバイス別(ディスクリート半導体、オプトエレクトロニクス、センサー、集積回路、その他)、コンポーネント別(メモリデバイス、ロジックデバイス、アナログIC、メモリ保護ユニット、ディスクリートパワーデバイス、多点制御ユニット、センサー、その他)、タイプ別(真性材料、真性外材料)、ノードサイズ別(5nm、5/7nm、7/10nm、14/16nm、20/22nm、 28/32nm、 40/45nm、 65nm、 90nm、 130nm、 180nm)、 材料タイプ別 ( ケイ素、 ゲルマニウム、 ガリウムヒ素、 炭化ケイ素、 窒化ガリウム、 その他)、 用途別 ( ネットワーキングおよび通信、 データ処理、 家電製品、 発電、 電子部品、 その他)、 エンドユーザー別 ( 電気通信、 エネルギー、 電気および電子、 医療およびヘルスケア、 自動車、 航空宇宙、 防衛および軍事、 政府、 その他):2024年から2034年までの機会分析および業界予測
レポートID : ROJP1024303 | 発行日 : 2024年10月 | フォーマット : : :
1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Japan Semiconductor Market - Introduction
4.1 Overview
4.2 Market Dynamics
4.3 Industry Trends
4.4 Competitive Intelligence
5 Japan Semiconductor Market Landscape
5.1 Historical and Current Market Trends (2019-2022)
5.2 Market Forecast (2023-2032)
6 Japan Semiconductor Market - Breakup by Devices
6.1 Discrete Semiconductors
6.1.1 Overview
6.1.2 Historical and Current Market Trends (2019-2022)
6.1.3 Market Forecast (2023-2032)
6.2 Optoelectronics
6.2.1 Overview
6.2.2 Historical and Current Market Trends (2019-2022)
6.2.3 Market Forecast (2023-2032)
6.3 Optoelectronics
6.3.1 Overview
6.3.2 Historical and Current Market Trends (2019-2022)
6.3.3 Market Forecast (2023-2032)
6.4 Integrated Circuits
6.4.1 Overview
6.4.2 Historical and Current Market Trends (2019-2022)
6.4.3 Market Forecast (2023-2032)
6.5 Others
6.4.1 Overview
6.4.2 Historical and Current Market Trends (2019-2022)
6.4.3 Market Forecast (2023-2032)
7 Japan Semiconductor Market - Breakup by Components
7.1 Memory Devices
7.1.1 Overview
7.1.2 Historical and Current Market Trends (2019-2022)
7.1.3 Market Forecast (2023-2032)
7.2 Logic Devices
7.2.1 Overview
7.2.2 Historical and Current Market Trends (2019-2022)
7.2.3 Market Forecast (2023-2032)
7.3 Analog IC
7.3.1 Overview
7.3.2 Historical and Current Market Trends (2019-2022)
7.3.3 Market Forecast (2023-2032)
7.4 Memory protection unit
7.4.1 Overview
7.4.2 Historical and Current Market Trends (2019-2022)
7.4.3 Market Forecast (2023-2032)
7.5 Discrete Power Devices
7.5.1 Overview
7.5.2 Historical and Current Market Trends (2019-2022)
7.5.3 Market Forecast (2023-2032)
7.6 Multipoint control unit
7.6.1 Overview
7.6.2 Historical and Current Market Trends (2019-2022)
7.6.3 Market Forecast (2023-2032)
7.7 Sensors
7.7.1 Overview
7.7.2 Historical and Current Market Trends (2019-2022)
7.7.3 Market Forecast (2023-2032)
7.8 Others
7.8.1 Overview
7.8.2 Historical and Current Market Trends (2019-2022)
7.8.3 Market Forecast (2023-2032)
8 Japan Semiconductor Market - Breakup by Type
8.1 Intrinsic material
8.1.1 Overview
8.1.2 Historical and Current Market Trends (2019-2022)
8.1.3 Market Forecast (2023-2032)
8.2 Extrinsic material
8.2.1 Overview
8.2.2 Historical and Current Market Trends (2019-2022)
8.2.3 Market Forecast (2023-2032)
9 Japan Semiconductor Market - Breakup by Node Size
9.1 5nm
9.1.1 Overview
9.1.2 Historical and Current Market Trends (2019-2022)
9.1.3 Market Forecast (2023-2032)
9.2 5/7nm
9.2.1 Overview
9.2.2 Historical and Current Market Trends (2019-2022)
9.2.3 Market Forecast (2023-2032)
9.3 7/10nm
9.3.1 Overview
9.3.2 Historical and Current Market Trends (2019-2022)
9.3.3 Market Forecast (2023-2032)
9.4 13/15nm
9.4.1 Overview
9.4.2 Historical and Current Market Trends (2019-2022)
9.4.3 Market Forecast (2023-2032)
9.5 20/22nm
9.5.1 Overview
9.5.2 Historical and Current Market Trends (2019-2022)
9.5.3 Market Forecast (2023-2032)
9.6 28/32nm
9.6.1 Overview
9.6.2 Historical and Current Market Trends (2019-2022)
9.6.3 Market Forecast (2023-2032)
9.7 40/45nm
9.7.1 Overview
9.7.2 Historical and Current Market Trends (2019-2022)
9.7.3 Market Forecast (2023-2032)
9.8 65nm
9.8.1 Overview
9.8.2 Historical and Current Market Trends (2019-2022)
9.8.3 Market Forecast (2023-2032)
9.9 90nm
9.1.1 Overview
9.1.2 Historical and Current Market Trends (2019-2022)
9.1.3 Market Forecast (2023-2032)
9.10 130nm
9.2.1 Overview
9.2.2 Historical and Current Market Trends (2019-2022)
9.2.3 Market Forecast (2023-2032)
9.11 180nm
9.3.1 Overview
9.3.2 Historical and Current Market Trends (2019-2022)
9.3.3 Market Forecast (2023-2032)
10 Japan Semiconductor Market - Breakup by Material Type
10.1 Silicon
10.1.1 Overview
10.1.2 Historical and Current Market Trends (2019-2022)
10.1.3 Market Forecast (2023-2032)
10.2 Germanium
10.2.1 Overview
10.2.2 Historical and Current Market Trends (2019-2022)
10.2.3 Market Forecast (2023-2032)
10.3 Gallium arsenide
10.3.1 Overview
10.3.2 Historical and Current Market Trends (2019-2022)
10.3.3 Market Forecast (2023-2032)
10.4 Silicon carbide
10.4.1 Overview
10.4.2 Historical and Current Market Trends (2019-2022)
10.4.3 Market Forecast (2023-2032)
10.5 Gallium Nitride
10.5.1 Overview
10.5.2 Historical and Current Market Trends (2019-2022)
10.5.3 Market Forecast (2023-2032)
11 Japan Semiconductor Market - Breakup by Application
11.1 Networking and Communication
11.1.1 Overview
11.1.2 Historical and Current Market Trends (2019-2022)
11.1.3 Market Forecast (2023-2032)
11.2 Data Processing
11.2.1 Overview
11.2.2 Historical and Current Market Trends (2019-2022)
11.2.3 Market Forecast (2023-2032)
11.3 Consumer Electronics
11.3.1 Overview
11.3.2 Historical and Current Market Trends (2019-2022)
11.3.3 Market Forecast (2023-2032)
11.4 Power Generation
11.4.1 Overview
11.4.2 Historical and Current Market Trends (2019-2022)
11.4.3 Market Forecast (2023-2032)
11.5 Electronic Components
11.5.1 Overview
11.5.2 Historical and Current Market Trends (2019-2022)
11.5.3 Market Forecast (2023-2032)
11.6 Others
11.6.1 Overview
11.6.2 Historical and Current Market Trends (2019-2022)
11.6.3 Market Forecast (2023-2032)
12 Japan Semiconductor Market - Breakup by End-User
12.1 Telecommunication
12.1.1 Overview
12.1.2 Historical and Current Market Trends (2019-2022)
12.1.3 Market Forecast (2023-2032)
12.2 Energy
12.2.1 Overview
12.2.2 Historical and Current Market Trends (2019-2022)
12.2.3 Market Forecast (2023-2032)
12.3 Electrical and Electronics
12.3.1 Overview
12.3.2 Historical and Current Market Trends (2019-2022)
12.3.3 Market Forecast (2023-2032)
12.4 Medical and Healthcare
12.4.1 Overview
12.4.2 Historical and Current Market Trends (2019-2022)
12.4.3 Market Forecast (2023-2032)
12.5 Automotive
12.5.1 Overview
12.5.2 Historical and Current Market Trends (2019-2022)
12.5.3 Market Forecast (2023-2032)
12.6 Aerospace
12.6.1 Overview
12.6.2 Historical and Current Market Trends (2019-2022)
12.6.3 Market Forecast (2023-2032)
12.7 Defense and Military
12.7.1 Overview
12.7.2 Historical and Current Market Trends (2019-2022)
12.7.3 Market Forecast (2023-2032)
12.8 Government
12.8.1 Overview
12.8.2 Historical and Current Market Trends (2019-2022)
12.8.3 Market Forecast (2023-2032)
13 Japan Semiconductor Market – Breakup by Region
13.1 Kanto Region
13.1.1 Overview
13.1.2 Historical and Current Market Trends (2019-2022)
13.1.3 Market Breakup by Components
13.1.4 Market Breakup by Material Used
13.1.5 Market Breakup by End User
13.1.6 Key Players
13.1.7 Market Forecast (2023-2032)
13.2 Kinki Region
13.2.1 Overview
13.2.2 Historical and Current Market Trends (2019-2022)
13.2.3 Market Breakup by Components
13.2.4 Market Breakup by Material Used
13.2.5 Market Breakup by End User
13.2.6 Key Players
13.2.7 Market Forecast (2023-2032)
13.3 Central/ Chubu Region
13.3.1 Overview
13.3.2 Historical and Current Market Trends (2019-2022)
13.3.3 Market Breakup by Components
13.3.4 Market Breakup by Material Used
13.3.5 Market Breakup by End User
13.3.6 Key Players
13.3.7 Market Forecast (2023-2032)
13.4 Kyushu-Okinawa Region
13.4.1 Overview
13.4.2 Historical and Current Market Trends (2019-2022)
13.4.3 Market Breakup by Components
13.4.4 Market Breakup by Material Used
13.4.5 Market Breakup by End User
13.4.6 Key Players
13.4.7 Market Forecast (2023-2032)
13.5 Tohoku Region
13.5.1 Overview
13.5.2 Historical and Current Market Trends (2019-2022)
13.5.3 Market Breakup by Components
13.5.4 Market Breakup by Material Used
13.5.5 Market Breakup by End User
13.5.6 Key Players
13.5.7 Market Forecast (2023-2032)
13.6 Chugoku Region
13.6.1 Overview
13.6.2 Historical and Current Market Trends (2019-2022)
13.6.3 Market Breakup by Components
13.6.4 Market Breakup by Material Used
13.6.5 Market Breakup by End User
13.6.6 Key Players
13.6.7 Market Forecast (2023-2032)
13.7 Hokkaido Region
13.7.1 Overview
13.7.2 Historical and Current Market Trends (2019-2022)
13.7.3 Market Breakup by Components
13.7.4 Market Breakup by Material Used
13.7.5 Market Breakup by End User
13.7.6 Key Players
13.7.7 Market Forecast (2023-2032)
13.8 Shikoku Region
13.8.1 Overview
13.8.2 Historical and Current Market Trends (2019-2022)
13.8.3 Market Breakup by Components
13.8.4 Market Breakup by Material Used
13.8.5 Market Breakup by End User
13.8.6 Key Players
13.8.7 Market Forecast (2023-2032)
14 Japan Semiconductor Market – Competitive Landscape
14.1 Overview
14.2 Market Structure
14.3 Market Player Positioning
14.4 Top Winning Strategies
14.5 Competitive Dashboard
14.6 Company Evaluation Quadrant
15 Profiles of Key Players
15.1 TDK Corporation
15.1.1 Business Overview
15.1.2 Services Offered
15.1.3 Business Strategies
15.1.4 SWOT Analysis
11.1.5 Major News and Events
15.2 IPFlex
15.2.1 Business Overview
15.2.2 Services Offered
15.2.3 Business Strategies
15.2.4 SWOT Analysis
15.2.5 Major News and Events
15.3 PEZY Computing
15.3.1 Business Overview
15.3.2 Services Offered
15.3.3 Business Strategies
15.3.4 SWOT Analysis
15.3.5 Major News and Events
15.4 Kodenshi AUK Group
15.4.1 Business Overview
15.4.2 Services Offered
15.4.3 Business Strategies
15.4.4 SWOT Analysis
15.4.5 Major News and Events
15.5 THine Electronics
15.5.1 Business Overview
15.5.2 Services Offered
15.5.3 Business Strategies
15.5.4 SWOT Analysis
15.5.5 Major News and Events
15.6 Socionext
15.6.1 Business Overview
15.6.2 Services Offered
15.6.3 Business Strategies
15.6.4 SWOT Analysis
15.6.5 Major News and Events
15.7 Mitsubishi Electric
15.7.1 Business Overview
15.7.2 Services Offered
15.7.3 Business Strategies
15.7.4 SWOT Analysis
15.7.5 Major News and Events
15.8 Toshiba Corporation
15.8.1 Business Overview
15.8.2 Services Offered
15.8.3 Business Strategies
15.8.4 SWOT Analysis
15.8.5 Major News and Events
15.9 Renesas Electronics
15.9.1 Business Overview
15.9.2 Services Offered
15.9.3 Business Strategies
15.9.4 SWOT Analysis
15.9.5 Major News and Events
15.10 Micron Memory Japan
15.10.1 Business Overview
15.10.2 Services Offered
15.10..3 Business Strategies
15.10.4 SWOT Analysis
15.10.5 Major News and Events
15.11 JAPAN MATERIAL Co
15.11.1 Business Overview
15.11.2 Services Offered
15.11.3 Business Strategies
15.11.4 SWOT Analysis
15.11.5 Major News and Events
15.12 Sanyo Electric Co., Ltd.
15.12.1 Business Overview
15.12.2 Services Offered
15.12.3 Business Strategies
15.12.4 SWOT Analysis
15.12.5 Major News and Events
15.13 Rapidus Corporation
15.13.1 Business Overview
15.13.2 Services Offered
15.13.3 Business Strategies
15.13.4 SWOT Analysis
15.13.5 Major News and Events
15.13 Seiko Group Corporation
15.13.1 Business Overview
15.13.2 Services Offered
15.13.3 Business Strategies
15.13.4 SWOT Analysis
15.13.5 Major News and Events
15.14 Sharp Corporation
15.14.1 Business Overview
15.14.2 Services Offered
15.14.3 Business Strategies
15.14.4 SWOT Analysis
15.14.5 Major News and Events
15.15 Shin-Etsu Chemical
15.15.1 Business Overview
15.15.2 Services Offered
15.15.3 Business Strategies
15.15.4 SWOT Analysis
15.15.5 Major News and Events
15.16 FERROTEC HOLDINGS Corp
15.16.1 Business Overview
15.16.2 Services Offered
15.16.3 Business Strategies
15.16.4 SWOT Analysis
15.16.5 Major News and Events
15.17 SUMCO Corporation
15.17.1 Business Overview
15.17.2 Services Offered
15.17.3 Business Strategies
15.17.4 SWOT Analysis
15.17.5 Major News and Events
15.18 Dainippon Screen
15.18.1 Business Overview
15.18.2 Services Offered
15.18.3 Business Strategies
15.18.4 SWOT Analysis
15.18.5 Major News and Events
15.19 AOI ELECTRONICS
15.19.1 Business Overview
15.19.2 Services Offered
15.19.3 Business Strategies
15.19.4 SWOT Analysis
15.19.5 Major News and Events
15.20 Intel Corporation
15.20.1 Business Overview
15.20.2 Services Offered
15.20.3 Business Strategies
15.20.4 SWOT Analysis
15.20.5 Major News and Events
15.21 Shindengen Electric Manufacturing
15.21.1 Business Overview
15.21.2 Services Offered
15.21.3 Business Strategies
15.21.4 SWOT Analysis
15.21.5 Major News and Events
15.22 FURUYA METAL C
15.22.1 Business Overview
15.22.2 Services Offered
15.22.3 Business Strategies
15.22.4 SWOT Analysis
15.22.5 Major News and Events
15.23 Samsung Electronics
15.23.1 Business Overview
15.23.2 Services Offered
15.23.3 Business Strategies
15.23.4 SWOT Analysis
15.23.5 Major News and Events
15.24 Others
15.24.1 Business Overview
15.24.2 Services Offered
15.24.3 Business Strategies
15.24.4 SWOT Analysis
15.24.5 Major News and Events
16 Japan Semiconductor Market - Industry Analysis
16.1 Drivers, Restraints, and Opportunities
16.1.1 Overview
16.1.2 Drivers
16.1.2.1 Support by the Government for Local Chip Manufacturing
16.1.3 Restraints
16.1.3.1 Inventory Drawdowns with Technological Advances and Higher Capital Costs
16.1.4 Opportunities
16.1.4.1 A Surge in the Utilization of Memory Devices
16.2 Porters Five Forces Analysis
16.2.1 Overview
16.2.2 Bargaining Power of Buyers
16.2.3 Bargaining Power of Suppliers
16.2.4 Degree of Competition
16.2.5 Threat of New Entrants
16.2.6 Threat of Substitutes
16.3 Value Chain Analysis
17 Appendix