日本モールディングコンパウンド市場規模、シェア、競争環境、動向分析レポート:モールディングタイプ別(シートモールディングコンパウンド、バルクモールディングコンパウンド、厚物モールディングコンパウンド)、コンパウンドタイプ別(熱硬化性コンパウンド、長繊維強コンパウンド、熱可塑性モールディングコンパウンド)、エンドユーザー別(航空宇宙、自動車、半導体/エレクトロニクス産業、石油、ガス及びエネルギー産業、その他): 2024 年から 2032 年までの機会分析と業界予測

レポートID : ROJP0524079  |  発行日 : 2024年05月  |  フォーマット :  :   : 

Table of Contents

1.       Research Methodology

2.       Project Scope & Definitions

3.       Impact of COVID-19 on the Japan Molding Compound Market

4.       Impact of Russia-Ukraine War

5.       Executive Summary

6.       Voice of Customer

6.1.    Market Awareness and Product Information

6.2.    Brand Awareness and Loyalty

6.3.    Factors Considered in Purchase Decision

6.3.1.Brand Name

6.3.2.Quality

6.3.3.Quantity

6.3.4.Price

6.3.5.Product Specification

6.3.6.Application Specification

6.3.7.Shelf-Life

6.3.8.Availability of Product

6.4.    Frequency of Purchase

6.5.    Medium of Purchase

7.       Japan Molding Compound Market Outlook, FY2017-FY2031

7.1.    Market Size & Forecast

7.1.1.By Value

7.1.2.By Volume

7.2.    By Molding Type

7.2.1.Sheet Molding Compound (SMC)

7.2.2.Bulk Molding Compound (BMC)

7.2.3.Thick Molding Compound (TMC)

7.3.    By Compound Type

7.3.1.Thermoset Compounds

7.3.1.1.              Phenolic

7.3.1.2.              Epoxy

7.3.1.3.              Silicone

7.3.1.4.              Unsaturated Polyester

7.3.1.5.              Diallyl Phthalate

7.3.1.6.              Others

7.3.2.Long Fiber Reinforced Composites

7.3.3.Thermoplastic Compounds

7.3.3.1.              Polyphenylene Sulfide (PPS)

7.3.3.2.              Polycarbonate (PC)

7.3.3.3.              Polyamide (PA)

7.4.    By End-user

7.4.1.Aerospace

7.4.1.1.              Passenger

7.4.1.2.              Commercial

7.4.1.3.              Defense

7.4.2.Automotive

7.4.2.1.              Passenger Cars

7.4.2.2.              Light Commercial Vehicles (LCVs)

7.4.2.3.              Heavy Commercial Vehicles (HCVs)

7.4.3.Semiconductors/Electronics Industry

7.4.4.Oil, Gas, & Energy Industry

7.4.5.Others

7.5.    By Region

7.5.1.North

7.5.2.Central

7.5.3.South

7.6.    By Company Market Share (%), FY2023

8.       Supply Side Analysis

8.1.    Capacity, By Company

8.2.    Production, By Company

8.3.    Operating Efficiency, By Company

8.4.    Key Plant Locations (Up to 25)

9.       Market Mapping, FY2023

9.1.    By Molding Type

9.2.    By Compound Type

9.3.    By End-user

9.4.    By Region

10.   Macro Environment and Industry Structure

10.1.                     Supply Demand Analysis

10.2.                     Import Export Analysis – Volume and Value

10.3.                     Supply/Value Chain Analysis

10.4.                     PESTEL Analysis

10.4.1.    Political Factors

10.4.2.    Economic System

10.4.3.    Social Implications

10.4.4.    Technological Advancements

10.4.5.    Environmental Impacts

10.4.6.    Legal Compliances and Regulatory Policies (Statutory Bodies Included)

10.5.                     Porter’s Five Forces Analysis

10.5.1.    Supplier Power

10.5.2.    Buyer Power

10.5.3.    Substitution Threat

10.5.4.    Threat from New Entrant

10.5.5.    Competitive Rivalry

11.   Market Dynamics

11.1.                     Growth Drivers

11.2.                     Growth Inhibitors (Challenges, Restraints)

12.   Key Players Landscape

12.1.                     Competition Matrix of Top Five Market Leaders

12.2.                     Market Revenue Analysis of Top Five Market Leaders (in %, FY2023)

12.3.                     Mergers and Acquisitions/Joint Ventures (If Applicable)

12.4.                     SWOT Analysis (For Five Market Players)

12.5.                     Patent Analysis (If Applicable)

13.   Pricing Analysis

14.   Case Studies

15.   Key Players Outlook

15.1.                     Resonac Electronic Materials Kyushu Corporation

15.1.1.    Company Details

15.1.2.    Key Management Personnel

15.1.3.    Products & Services

15.1.4.    Financials (As reported)

15.1.5.    Key Market Focus & Geographical Presence

15.1.6.    Recent Developments

15.2.                     Huayuan

15.3.                     Sumitomo Bakelite Co., Ltd.

15.4.                     MOLYMER SSP Co., Ltd.

15.5.                     BASF SE

15.6.                     Hitachi, Ltd.

15.7.                     Henkel AG & Co. KGaA

15.8.                     Evonik

15.9.                     SAMPE JAPAN

15.10.                  Huntsman International LLC.

16.   Strategic Recommendations

17.   About Us & Disclaimer

Booklet
  • 発行日 :
    May-2024
  • 予想年 :
    2024年~2032年
  • 納期 :

ご要望に応じて日本語のレポートもご用意いたします。

ライセンスタイプを選択

シングルユーザーライセンス

299000 円

マルチユーザーライセンス

375000 円

法人ライセンス

485000 円

お問い合わせ