日本熱ストレスモニター市場規模、シェア、競争環境、トレンド分析レポート:提供別(ハードウェア、ソフトウェア、サービス)、技術別(湿球、乾球)、センサータイプ別(地球温度計、湿度、気流)、製品タイプ別(ハンドヘルド/ポータブル/固定式)、用途別(陸上競技およびスポーツ、鉱業、石油およびガス、軍事、製造工場):2024年から2032年までの機会分析および業界予測
レポートID : ROJP1224419 | 発行日 : 2024年12月 | フォーマット : : :
1. Research Background
1.1 Research Objectives
1.2 Market Definition
1.3 Analysis Period
1.4 Market Data Reporting Unit
1.4.1 Value
1.5 Market Size Breakdown by Segment
1.5.1 Market Segmentation by Offering
1.5.2 Market Segmentation by Technology
1.5.3 Market Segmentation by Sensor Type
1.5.4 Market Segmentation by Product Type
1.5.5 Market Segmentation by Application
1.5.6 Market Segmentation by Region
1.6 Key Stakeholders
2. Research Methodology
2.1 Secondary Research
2.1.1 Paid
2.1.2 Unpaid
2.1.3 P&S Intelligence Database
2.2 Primary Research
2.2.1 Breakdown of Primary Research, by Region
2.2.2 Breakdown of Primary Research, by Industry Participant
2.2.3 Breakdown of Primary Research, by Designation
2.2.4 Breakdown of Primary Research, by Company Type
2.3 Market Size Estimation
2.4 Data Triangulation
2.5 Currency Conversion Rates
2.6 Notes and Caveats
3. Executive Summary
4. Voice of Industry Experts/KOLs
5. Market Indicators
5.1 Number of Fatalities due to Heat Stress
5.2 Number of Emergency Transportations due to Heat Stress in Japan in 2020 Summer during COVID-19 Pandemic
5.3 Temperature Variation Over the Years
6. Definition of Market Segments
6.1 By Offering
6.1.1 Hardware
6.1.2 Software
6.1.3 Service
6.2 By Technology
6.2.1 Wet Bulb
6.2.2 Dry Bulb
6.3 By Product Type
6.3.1 Handheld/Portable
6.3.2 Fixed
6.4 By Sensor Type
6.4.1 Globe Thermometer
6.4.2 Humidity
6.4.3 Air Flow
6.5 By Application
6.5.1 Athletics & Sports
6.5.2 Mining and Oil & Gas
6.5.3 Military
6.5.4 Manufacturing Plants
6.5.5 Others
7. Industry Outlook
7.1 Market Dynamics
7.1.1 Trends
7.1.1.1 Advancements in portable and wearable heat stress monitors
7.1.2 Drivers
7.1.2.1 Rising need for heat stress monitoring amongst athletes and military personnel
7.1.2.2 Stringent government regulations for heat stress management
7.1.2.3 Impact analysis of drivers on market forecast
7.1.3 Restraints
7.1.3.1 Shrinking population and labor shortage
7.1.3.2 Impact analysis of restraints on market forecast
7.1.4 Opportunities
7.1.4.1 Integration of AI in heat stress monitoring
7.2 Impact of COVID-19
7.3 Value Chain Analysis
7.4 Porter's Five Forces Analysis
7.4.1 Bargaining Power of Buyers
7.4.2 Bargaining Power of Suppliers
7.4.3 Intensity of Rivalry
7.4.4 Threat of New Entrants
7.4.5 Threat of Substitutes
8. Policy and Regulatory Landscape
9. Japan Market Size and Forecast
9.1 Overview
9.2 Market Revenue, by Offering (2024-2032)
9.3 Market Revenue, by Technology (2024-2032)
9.4 Market Revenue, by Sensor Type (2024-2032)
9.5 Market Revenue, by Product Type (2024-2032)
9.6 Market Revenue, by Application (2024-2032)
9.7 Market Revenue, by Region (2024-2032)
10. Competitive Landscape
10.1 List of Market Players and Their Offerings
10.2 Market Share Analysis of Key Players
10.3 Recent Strategic Developments of Player/Key Players
11. Company Profiles
11.1 Kyoto Electronics Manufacturing Co. Ltd.
11.1.1 Business Overview
11.1.2 Product and Service Offerings
11.2 Nielsen-Kellerman Co.
11.2.1 Business Overview
11.2.2 Product and Service Offerings
11.3 Keyence Corporation
11.3.1 Business Overview
11.3.2 Product and Service Offerings
11.3.3 Key Financial Summary
11.4 TSI Incorporated
11.4.1 Business Overview
11.4.2 Product and Service Offerings
11.5 Fujitsu Limited
11.5.1 Business Overview
11.5.2 Product and Service Offerings
11.5.3 Key Financial Summary
11.6 Sato Keiryoki Mfg. Co. Ltd.
11.6.1 Business Overview
11.6.2 Product and Service Offerings
11.7 General Tools & Instruments LLC
11.7.1 Business Overview
11.7.2 Product and Service Offerings
11.8 Sper Scientific Ltd.
11.8.1 Business Overview
11.8.2 Product and Service Offerings
11.9 Besantek Corporation
11.9.1 Business Overview
11.9.2 Product and Service Offerings
11.10 Teledyne FLIR LLC
11.10.1 Business Overview
11.10.2 Product and Service Offerings
12. Appendix
12.1 Abbreviations
12.2 Sources and References
12.3 Related Reports