世界3D IC市場規模、シェア、競争環境、トレンド分析レポート：技術別（スルーシリコンビア（TSV）、3Dファンアウトパッケージング、3Dウェハースケールレベル・チップスケールパッケージング（WLCSP）、モノリシック3D IC、その他）、コンポーネント別（3Dメモリ、LED、センサー、プロセッサー、その他）、用途別（ロジック・メモリ統合、イメージング・オプトエレクトロニクス、MEMS・センサー、LEDパッケージング、その他）、エンドユーザー別（コンシューマーエレクトロニクス、IT・通信、自動車、ヘルスケア、航空宇宙・防衛、産業用、その他）： 2025年から2033年までの機会分析および業界予測

レポートID : ROJP0325517 | 発行日 : 2025年03月 | フォーマット : : :

無料サンプル

試読申込

見積もり

Table of Content

Introduction
- Definition, By Segment
- Research Methodology/Approach
- Data Sources
Executive Summary
Market Dynamics
- Macro and Micro Economic Indicators
- Drivers, Restraints, Opportunities and Trends
- Impact of Generative AI
Competition Landscape
- Business Strategies Adopted by Key Players
- Consolidated SWOT Analysis of Key Players
- Global 3D IC Key Players (Top 3 – 5) Market Share/Ranking, 2024
Global 3D IC Market Size Estimates and Forecasts, By Segments, 2025-2033
- Key Findings
- By Technology (USD)
  - Through-Silicon Via (TSV)
  - 3D Fan-Out Packaging
  - 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
  - Monolithic 3D ICs
  - Others (Through-Glass Via (TGV), etc.)
- By Component (USD)
  - 3D Memory
  - LEDs
  - Sensors
  - Processors
  - Others (Microelectronical Systems, etc.)
- By Application (USD)
  - Logic and Memory Integration
  - Imaging and Optoelectronics
  - MEMS and Sensors
  - LED Packaging
  - Others (Power Management, etc.)
- By End-user (USD)
  - Consumer Electronics
  - IT and Telecommunications
  - Automotive
  - Healthcare
  - Aerospace and Defense
  - Industrial
  - Others (Energy and Utilities, etc.)
- By Region (USD)
  - North America
  - South America
  - Europe
  - Middle East and Africa
  - Asia Pacific
North America 3D IC Market Size Estimates and Forecasts, By Segments, 2025-2033
- Key Findings
- By Technology (USD)
  - Through-Silicon Via (TSV)
  - 3D Fan-Out Packaging
  - 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
  - Monolithic 3D ICs
  - Others (Through-Glass Via (TGV), etc.)
- By Component (USD)
  - 3D Memory
  - LEDs
  - Sensors
  - Processors
  - Others (Microelectronical Systems, etc.)
- By Application (USD)
  - Logic and Memory Integration
  - Imaging and Optoelectronics
  - MEMS and Sensors
  - LED Packaging
  - Others (Power Management, etc.)
- By End-user (USD)
  - Consumer Electronics
  - IT and Telecommunications
  - Automotive
  - Healthcare
  - Aerospace and Defense
  - Industrial
  - Others (Energy and Utilities, etc.)
- By Country (USD)
  - United States
    - End-user
  - Canada
    - End-user
  - Mexico
    - End-user
South America 3D IC Market Size Estimates and Forecasts, By Segments, 2025-2033
- Key Findings
- By Technology (USD)
  - Through-Silicon Via (TSV)
  - 3D Fan-Out Packaging
  - 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
  - Monolithic 3D ICs
  - Others (Through-Glass Via (TGV), etc.)
- By Component (USD)
  - 3D Memory
  - LEDs
  - Sensors
  - Processors
  - Others (Microelectronical Systems, etc.)
- By Application (USD)
  - Logic and Memory Integration
  - Imaging and Optoelectronics
  - MEMS and Sensors
  - LED Packaging
  - Others (Power Management, etc.)
- By End-user (USD)
  - Consumer Electronics
  - IT and Telecommunications
  - Automotive
  - Healthcare
  - Aerospace and Defense
  - Industrial
  - Others (Energy and Utilities, etc.)
- By Country (USD)
  - Brazil
    - End-user
  - Argentina
    - End-user
  - Rest of South America
Europe 3D IC Market Size Estimates and Forecasts, By Segments, 2025-2033
- Key Findings
- By Technology (USD)
  - Through-Silicon Via (TSV)
  - 3D Fan-Out Packaging
  - 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
  - Monolithic 3D ICs
  - Others (Through-Glass Via (TGV), etc.)
- By Component (USD)
  - 3D Memory
  - LEDs
  - Sensors
  - Processors
  - Others (Microelectronical Systems, etc.)
- By Application (USD)
  - Logic and Memory Integration
  - Imaging and Optoelectronics
  - MEMS and Sensors
  - LED Packaging
  - Others (Power Management, etc.)
- By End-user (USD)
  - Consumer Electronics
  - IT and Telecommunications
  - Automotive
  - Healthcare
  - Aerospace and Defense
  - Industrial
  - Others (Energy and Utilities, etc.)
- By Country (USD)
  - United Kingdom
    - End-user
  - Germany
    - End-user
  - France
    - End-user
  - Italy
    - End-user
  - Spain
    - End-user
  - Russia
    - End-user
  - Benelux
    - End-user
  - Nordics
    - End-user
  - Rest of Europe
Middle East and Africa 3D IC Market Size Estimates and Forecasts, By Segments, 2025-2033
- Key Findings
- By Technology (USD)
  - Through-Silicon Via (TSV)
  - 3D Fan-Out Packaging
  - 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
  - Monolithic 3D ICs
  - Others (Through-Glass Via (TGV), etc.)
- By Component (USD)
  - 3D Memory
  - LEDs
  - Sensors
  - Processors
  - Others (Microelectronical Systems, etc.)
- By Application (USD)
  - Logic and Memory Integration
  - Imaging and Optoelectronics
  - MEMS and Sensors
  - LED Packaging
  - Others (Power Management, etc.)
- By End-user (USD)
  - Consumer Electronics
  - IT and Telecommunications
  - Automotive
  - Healthcare
  - Aerospace and Defense
  - Industrial
  - Others (Energy and Utilities, etc.)
- By Country (USD)
  - Turkey
    - End-user
  - Israel
    - End-user
  - GCC
    - End-user
  - North Africa
    - End-user
  - South Africa
    - End-user
  - Rest of Middle East and Africa
Asia Pacific 3D IC Market Size Estimates and Forecasts, By Segments, 2025-2033
- Key Findings
- By Technology (USD)
  - Through-Silicon Via (TSV)
  - 3D Fan-Out Packaging
  - 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
  - Monolithic 3D ICs
  - Others (Through-Glass Via (TGV), etc.)
- By Component (USD)
  - 3D Memory
  - LEDs
  - Sensors
  - Processors
  - Others (Microelectronical Systems, etc.)
- By Application (USD)
  - Logic and Memory Integration
  - Imaging and Optoelectronics
  - MEMS and Sensors
  - LED Packaging
  - Others (Power Management, etc.)
- By End-user (USD)
  - Consumer Electronics
  - IT and Telecommunications
  - Automotive
  - Healthcare
  - Aerospace and Defense
  - Industrial
  - Others (Energy and Utilities, etc.)
- By Country (USD)
  - China
    - End-user
  - India
    - End-user
  - Japan
    - End-user
  - South Korea
    - End-user
  - ASEAN
    - End-user
  - Oceania
    - End-user
  - Rest of Asia Pacific
Company Profiles for Top 10 Players (Based on data availability in public domain and/or on paid databases)
- Samsung
  - Overview
    - Key Management
    - Headquarters
    - Offerings/Business Segments
  - Key Details (Key details are consolidated data and not product/service specific)
    - Employee Size
    - Past and Current Revenue
    - Geographical Share
    - Business Segment Share
    - Recent Developments
- Taiwan Semiconductor Manufacturing (TSMC)
  - Overview
    - Key Management
    - Headquarters
    - Offerings/Business Segments
  - Key Details (Key details are consolidated data and not product/service specific)
    - Employee Size
    - Past and Current Revenue
    - Geographical Share
    - Business Segment Share
    - Recent Developments
- Advanced Micro Devices, Inc.
  - Overview
    - Key Management
    - Headquarters
    - Offerings/Business Segments
  - Key Details (Key details are consolidated data and not product/service specific)
    - Employee Size
    - Past and Current Revenue
    - Geographical Share
    - Business Segment Share
    - Recent Developments
- Broadcom Inc.
  - Overview
    - Key Management
    - Headquarters
    - Offerings/Business Segments
  - Key Details (Key details are consolidated data and not product/service specific)
    - Employee Size
    - Past and Current Revenue
    - Geographical Share
    - Business Segment Share
    - Recent Developments
- Micron Technology, Inc.
  - Overview
    - Key Management
    - Headquarters
    - Offerings/Business Segments
  - Key Details (Key details are consolidated data and not product/service specific)
    - Employee Size
    - Past and Current Revenue
    - Geographical Share
    - Business Segment Share
    - Recent Developments
- NVIDIA Corporation
  - Overview
    - Key Management
    - Headquarters
    - Offerings/Business Segments
  - Key Details (Key details are consolidated data and not product/service specific)
    - Employee Size
    - Past and Current Revenue
    - Geographical Share
    - Business Segment Share
    - Recent Developments
- Xilinx, Inc.
  - Overview
    - Key Management
    - Headquarters
    - Offerings/Business Segments
  - Key Details (Key details are consolidated data and not product/service specific)
    - Employee Size
    - Past and Current Revenue
    - Geographical Share
    - Business Segment Share
    - Recent Developments
- Amkor Technology, Inc.
  - Overview
    - Key Management
    - Headquarters
    - Offerings/Business Segments
  - Key Details (Key details are consolidated data and not product/service specific)
    - Employee Size
    - Past and Current Revenue
    - Geographical Share
    - Business Segment Share
    - Recent Developments
- ASE Technology Holding Co., Ltd.
  - Overview
    - Key Management
    - Headquarters
    - Offerings/Business Segments
  - Key Details (Key details are consolidated data and not product/service specific)
    - Employee Size
    - Past and Current Revenue
    - Geographical Share
    - Business Segment Share
    - Recent Developments
- Toshiba Corporation
  - Overview
    - Key Management
    - Headquarters
    - Offerings/Business Segments
  - Key Details (Key details are consolidated data and not product/service specific)
    - Employee Size
    - Past and Current Revenue
    - Geographical Share
    - Business Segment Share
    - Recent Developments